Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Drag Fluctuations of a Fully Deployed Flow Actuator Embedded Inside Turbulent Boundary Layer Flow - new

Dr. A. Elzawawy[1]
[1]Engineering & Technology Department, Vaughn College of Aeronautics & Technology, Flushing, NY, USA

Introduction: In this work, a CFD model of 2D flow around a fully deployed flow actuator was developed using COMSOL Multiphysics® software and the CFD Module. The results of COMSOL modeling is also compared with the experimental data of the same dimensions actuator. The 100mmX2mm rectangular actuator is placed inside a turbulent boundary layer flow as shown in Figure 1. The experiments [1], [2 ...

Purcell Effect via Numerical Simulation - new

I. Zabkov [1], V. Klimov[1], A. Pavlov[1], D. Guzatov[2]
[1]All-Russia Research Institute of Automatics (VNIIA), Moscow, Russia
[2]Yanka Kupala State University of Grodno, Grodno, Belarus

As it is known nano-sized emitters (such as atoms, quantum dots and point defects in diamonds) interaction with nano-environment leads to drastic changes of their decay rate and therefore lifetime (Purcell effect). To calculate the influence in general one needs to solve equations of quantum electrodynamics. However in weak interaction limit these emitters can be considered as point electric ...

Thermomechanical Effects of the Packaging Molding Process on the Chip in Integrated Circuits - new

N. Semmar[1], M. Fournier[1], P. S. Alleaume [2], A. Seigneurin [3], , ,
[1]GREMI-UMR7344, CNRS/University of Orléans, Orléans, France
[2]Collegium Sciences et Techniques, Orléans, France
[3]ST Microelectronics Tours SAS, Tours, France

Usually, in integrated circuits, the chip is brazed on leadframe and then, a polymer resin is molded around to create the packaging. On the first hand, the molding process at high temperatures will induce thermomechanical stress on the chip. As the leadframe, the chip and the braze have all different thermoelastic properties, these stress can be critical for the chip connections. To ...

Simulation Study in Design of Miniaturized MID-Infrared Sensors

B. Mizaikoff, X. Wang, and S.-S. Kim
Institut für Analytische und Bioanalytische Chemie
Universität Ulm
Ulm, Deutschland

Evanescent-wave optical waveguide is widely used as sensing platform for chemical/biological sensor applications. Our research group contributed to on-chip IR sensor technology and made recent progress in miniaturizing such devices utilizing quantum cascade lasers (QCL) in combination with planar GaAs/Al0.2Ga0.8As waveguides. Furthermore progress is reported toward microfabricated Mid-infrared ...

Multiphysical Modeling of Calcium Carbonate Transportation in UV Disinfection in Water Treatment

E. R. Blatchley[1], and B.Z. Sun[1]
[1]Department of Civil Engineering, Purdue University, West Lafayette, IN, USA

Mineral precipitation on to the quartz surface of the lamp jackets in UV disinfection process (fouling) has been recognized as a major problem for UV radiation delivery during disinfection operation. Fouling behavior was observed to be induced thermally and influenced by hydraulic character of the UV disinfection configuration. Fouling process involves momentum, heat, and mass transport within ...

A Consistent Environment for the Numerical Prediction of the Properties of Composite Materials

J. Schumacher[1], P. Fideu[2], G. Ziegmann[1], and A. Herrmann[3]
[1]TU Clausthal-Institute of Polymere Materials and Plastic Engineering, Clausthal-Zellerfeld, Germany
[2]CTC GmbH Stade, Stade, Germany
[3]Faserinstitut Bremen e.V., Bremen, Germany

The current paper focuses on the creation of a consistent environment for the numerical prediction of the physical properties of polymer composite. A limitation factor for the successful simulation of composite processes is the correct estimation of the effective properties depending on several factors such as the constituents (fiber, polymer), the process setup. The numerical prediction of the ...

Inlay Fixed Partial Denture Framework 3-D Structural Integrity Validation Using COMSOL Multiphysics®

T.M.R. Alho[1]

[1]Department of Electrical Engineering and Automation, University of Vaasa, Vaasa, Finland

Manual manufacturing of inlay fixed partial denture frameworks by metal casting can take hours of dental practitioners work time. This paper introduces 3-D simulations of premanufactured inlay fixed partial denture framework assembled from laser cut sheet metal parts. The study gives a good estimation of how well the frameworks can withstand strong human occlusion forces and masticatory cycle. ...

Reliability Evaluation for Static Chamber Method at Landfill Sites

H. Ishimori[1], K. Endo[1], and M. Yamada[1]
[1]National Institute for Environmental Studies, Tsukuba, Ibaraki, Japan

In this study, COMSOL Multiphysics was used for the reliability evaluation for static chamber method at landfill sites. Static chamber method, which measures landfill gas emission fluxes, is widely used at landfill sites for the monitoring of greenhouse gas emission such as methane and carbon dioxide. The accuracy and the reliability of static chamber method are dependent on the measuring ...

The Effect of a Correlated Surface Roughness and Convection on Heat Conduction

A.F. Emery[1]
[1]Department of Mechanical Engineering, University of Washington, Seattle, Washington, USA

Heat conduction through a slab, 0 ≤ x ≤ W is one dimensional. However, if one of the edges, say x=0, is rough the conduction will be two dimensional. The two dimensionality varies with the correlation length with a maximum at a length approximately 10% of the slab width. The maximum percentage standard deviation of the flux is of the order of 3 time that of the roughness. Monte ...

Coupled Fluid-Structural Analysis of Heart Mitral Valve

A. Avanzini, and G. Donzella
Department of Mechanical and Industrial Engineering, University of Brescia, Brescia, Italy

The mitral valve apparatus is a complex and refined mechanism located between the left atrium and the left ventricle of the heart which can manifest various kinds of pathologies. In order to support identification of potentially critical conditions resulting from some typical cardiosurgery operations, it is important to develop models of the mitral valve that enable prediction of both stress in ...

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