Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

3D Simulation of the Electric Field of Polymeric Insulators under Adverse Conditions

D. F. Reis [1], E. J. da Silva [1], I. J. S. Lopes [1],
[1] Universidade Federal de Minas Gerais, Belo Horizonte, MG, Brazil

Recent studies report problems related to premature aging and degradation of high-voltage polymeric insulators. Corona activity, which is induced in areas of high electric field levels, is considered one of the leading causes of these problems. The insulator operation under adverse conditions including rain, fog, dew and pollution is affected by these key factors that modify the electric field ...

X80 管线钢焊接接头局部腐蚀的数值模拟

朱国利 [1], 李亚东 [1], 李焰 [1],
[1] 中国石油大学(华东),青岛,中国

管道输送是油气能源长距离输送的重要途径。目前管道连接多采用焊接完成,焊接是一个复杂的非平衡物理化学过程,焊接接头各组成部分的成分、组织和性能都存在差异,同时还容易产生裂纹、气孔、夹杂和未熔合等焊接缺陷和较大的残余应力,使得焊接接头成为管道工程中的薄弱环节。在服役介质中,焊接接头存在宏观腐蚀电池与微观腐蚀电池耦合的多相电化学反应而引起局部腐蚀,可能导致整个构件失效,引发严重的安全事故,造成重大的经济损失甚至人身伤亡。利用 COMSOL Multiphysics® 多物理场仿真软件的腐蚀模块和二次电流分布接口对 X80 钢焊接接头在 CO2 饱和的 NACE 溶液中的电流密度及电位分布进行了仿真,并利用参数化扫描功能,模拟了焊缝与母材不同比例条件下的腐蚀行为。(图1)、(图2)、(图3)和(图4)分别为焊缝:母材=1:3和1:8条件下焊接接头在 NACE 溶液中的电流密度和电位分布 ...

Green's Function Approach to Efficient 3D Electrostatics of Multi-Scale Problems

C. Roman [1], L. Schmid [1], L. Stolpmann [1], C. Hierold [1],
[1] ETH, Zurich, Switzerland

We present an efficient method to compute efficiently the general solution (Green's Function) of the Poisson Equation in 3D. The method proves its effectiveness when dealing with multi-scale problems in which lower dimensional objects, such as nanotubes or nanowires (1D), are embedded in 3D. Our case-study is a field effect device with a carbon nanotube channel having diameter around 2 nm and ...

Microfluidic Simulation of a Separation System of T.cruzi from Blood Samples

S. L. Florez [1], M. J. Noguera [1], A. L. Campaña [1], J. C. Cruz [1], J. F. Osma [2],
[1] Department of Biomedical Engineering, University of Los Andes, Bogotá, Colombia
[2] Department of Electrical and Electronics Engineering, Microelectronics Center, University of Los Andes, Bogotá, Colombia

In 2014, it was estimated that there are between 6 to 7 million people worldwide infected by Chagas disease and approximately 25 million people are currently at risk. The parasite Trypanosoma cruzi (T. cruzi) causes this disease and according to the World Health Organization (WHO) it can be found all over the world with its highest incidence rates in Latin American countries. In the United ...

直流 GIL 内金属微粒对表面电荷积聚影响的 COMSOL 三维仿真研究

倪潇茹 [1], 常帅 [1], 王志远 [1], 王靖瑞 [1], 于万水 [1],
[1] 华北电力大学

以 SF6 或 SF6/N2 混合气体为绝缘介质的 GIL 具有大容量、高可靠性和环境友好等特点,而 GIL 中存在的金属微粒污染问题是提高设备绝缘强度研究中的关键技术难题。在 GIL 中,金属微粒引起的电场畸变会带来一系列绝缘问题,这些问题需要进行深入研究。针对直流 GIL 中金属微粒污染问题,本文研究其对绝缘子表面电荷积聚的影响。充分考虑附着导电微粒的情况,建立了可以灵活设置微粒与绝缘子相对位置的三维模型,利用 COMSOL Multiphysics® 软件的 AC/DC 模块对三维空间中绝缘子下绝缘子形状及表面附着微粒的不同粘附形态对表面电荷积聚的影响进行了求解分析。基于麦克斯韦方程组理论,我们首先对绝缘子表面电荷的积聚情况进行分析。然后纳入微粒污染以及气体侧微观尺度空间离子的产生、复合、迁移和扩散等作用,进一步建立了微粒污染情况下包含气体侧微观机制的绝缘子表面电荷积聚模型。 ...

Simulation of Chromatographic Band Transport

B. Bunner , A. Kromidas , M. Kele , and U. Neue
Waters Corp, Milford, MA, USA

High-Performance Liquid Chromatography (HPLC) is a standard method in the pharmaceutical industry for the separation and identification of chemical compounds. Modeling of band transport, or band broadening phenomena, can provide tremendous insight into problems of chromatography that are difficult or impossible to measure experimentally. We used COMSOL to analyze two classes of problems in ...

Modeling of a Dielectric Barrier Discharge Lamp for UV Production

S. Bhosle, R. Diez, H. Piquet, D. Le Thanh, B. Rahmani, D. Buso
Université de Toulouse, Toulouse, France

Excilamps are artificial Ultraviolet sources based on the emission of excimers or exciplexes. The latter are excited states of weakly bound rare gas or halide/rare gas atoms which emit a photon in the UV region when they dissociate. Dielectric Barrier Discharge (DBD) excilamps are promising UV sources for the future, provided the coupling between their power supply is optimized. The model ...

Simulation of a Diesel Oxidation Catalyst Used in a NOx Storage and Reduction system for Heavy Duty Trucks

C. Odenbrand, and E. Senar Serra
Department of Chemical Engineering, Lund University, Lund, Sweden

This work concerns the performance of an oxidation catalyst used in a NOx storage and reduction system. The oxidation of NO is the main objective of this study, where the presence of CO and propene has also been taken into account. Experimental data has been determined on a monolithic oxidation catalyst mounted after a heavy duty diesel engine in a rig. The conversion of hydrocarbons is ...

Modeling Ion Motion in a Miniaturized Ion Mobility Spectrometer

S. Barth, and S. Zimmermann
Drägerwerk AG & Co. KGaA, Lübeck, Germany

Ion mobility spectrometry provides fast detection of very low concentrations of chemical substances. Simple instrumentation combined with high sensitivity and high selectivity are the advantages of this technique. One well established field of application is the detection of hazardous compounds in air, such as chemical warfare agents, explosives and pollutants. A numerical model based on finite ...

Experimentally Matched Finite Element Modeling of Thermally Actuated SOI MEMS Micro-Grippers Using COMSOL Multiphysics

M. Guvench[1], and J. Crosby[1]
[1]University of Southern Maine, Gorham, Maine, USA

In “Micro-Electro-Mechanical-Systems” shortly known as MEMS, one of the most important and effective principle of creating transduction of electrical power to displacement force is thermal expansion. A slim beam of MEMS material, typically Silicon, is heated by the application of electrical current via Joule heating; it expands and creates motion. In the design of many MEMS devices ...