Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Modeling of Silicon Piezoresistive Pressure Sensor: Application to Prevent Some Diabetes Complications

F. Kerrour[1], A. Beddiaf[1], M. Benabbas-Marir[1]
[1]MODerNa Laboratory, University Mentouri, Constantine, Algeria

Several analytical solutions describing the mechanical behavior of a silicon micro membrane deflection, perfectly embedded and subjected to a uniform and constant pressure have been proposed. The obtained results are compared with those obtained by using COMSOL software for a rectangular diaphragm deflection. COMSOL Multiphysics is powerful software for solving problems based on partial ...

Numerical and Experimental Evaluation for Measurement of a Single Red Blood Cell Deformability Using a Microchannel and Electric Sensors

K. Tatsumi[1]
[1]Kyoto University, Kyoto City, Kyoto, Japan

An electric micro-resistance sensor that can continuously measure the deformability of a single red blood cell (RBC) in a microchannel and a numerical model that can simulate the resistance and capacitance of the cell membrane and cytoplasm are developed and improved. The resistance signal pattern between the electrodes is measured to evaluate the feasibility of the present sensor, using the ...

Mathematical Modeling of Zig-Zag Traveling-Wave Electro-Osmotic Micropumps

J. Hrdlicka[1], P. Cervenka[1], M. Pribyl[1], and D. Snita[1]
[1]Department of Chemical Engineering, Institute of Chemical Technology Prague, Prague, Czech Republic

In this paper we present results of the mathematical modeling of AC electroosmotic micropumps. Unlike others we use the full dynamic description, instead of the linearized model. Skewed hybrid discretization meshes are employed in order to accurately capture the main features of the studied system. Also, we introduce zig-zag electrode arrangements for traveling-wave electroosmotic micropumps. ...

Experimentally Matched Finite Element Modeling of Thermally Actuated SOI MEMS Micro-Grippers Using COMSOL Multiphysics

M. Guvench[1], and J. Crosby[1]
[1]University of Southern Maine, Gorham, Maine, USA

In “Micro-Electro-Mechanical-Systems” shortly known as MEMS, one of the most important and effective principle of creating transduction of electrical power to displacement force is thermal expansion. A slim beam of MEMS material, typically Silicon, is heated by the application of electrical current via Joule heating; it expands and creates motion. In the design of many MEMS devices ...

Combined Analytical and Numerical Modeling of a Resonant MEMS Sensor for Viscosity and Mass Density Measurements

S. Cerimovic[1], R. Beigelbeck[2], H. Antlinger[3], J. Schalko[2], B. Jakoby[3], and F. Keplinger[1]
[1]Institute of Sensor and Actuator Systems, Vienna University of Technology, Vienna, Austria
[2]Institute for Integrated Sensor Systems, Austrian Academy of Sciences, Wiener Neustadt, Austria
[3]Institute for Microelectronics and Microsensors, Johannes Kepler University Linz, Linz, Austria

A resonant MEMS sensor for viscosity and mass density measurements of liquids was modeled. The device is based on Lorentz-force excitation and features an integrated piezoresistive readout. The core sensing element is a rectangular vibrating plate suspended by four beam springs. The liquid surrounding the plate influences the resonant behavior of the system. Thus, evaluating the properties of ...

Multi-Domain Analysis of Silicon Structures for MEMS Based-Sensors

N. Bhalla[1], S. Li[2], and D. Chung[1]
[1]Chung Yuan Christian University, Chungli,Taiwan
[2]National Tsing Hua University, Hsinchu, Taiwan

Investigation in this paper aims at performing Mechanical Stress Strain analysis, Thermal, Piezoresistive and Piezoeletric analysis of Silicon Structures using COMSOL. The simulation results have been cross checked by mathematical calculation.

Simulating Frequency Nonlinearities in Quartz Resonators at High Temperature and Pressure

A. Beerwinkle[1], R. Singh[1], and G. Kirikera[2]
[1]Mechanics of Advanced Materials Laboratory, School of Mechanical and Aerospace Engineering, Oklahoma State University, Tulsa, OK
[2]Geophysical Research Company, LLC, (GRC) Tulsa, OK

A three-dimensional finite element model, based on the linear field equations for superimposed small vibrations onto nonlinear thermoelastic stressed media given by Lee and Yong, was developed. This method involves solving the thermal stress and piezoelectric model with geometric and material nonlinearities. The thickness-shear mode frequency response of the model was benchmarked to ...

Modeling an electric cell actuator and loudspeaker using COMSOL Multiphysics

W. J. Wu
NTU Nano-Bio MEMS Group
National Taiwan University,
Taiwan

This presentation presented the following: * The building of an FEA model of an electric cell actuator using COMSOL Multiphysics * Validation of this model through the AVID and ESPI measurement systems * The building of an FEA model of an electric loudspeaker using COMSOL Multiphysics * Validation of this model throughan acoustic measurement systems This paper is in Chinese.

FEM-Simulation of a Printed Acceleration Sensor with RF Readout Circuit

H. Schweiger[1], T. Göstenkors[1], R. Bau[1], D. Zielke[1]
[1]Dept. Engineering Sciences and Mathematics, University of Applied Sciences Bielefeld, Bielefeld, Germany

In this paper we want to figure out the development of a capacitive acceleration-sensor system with the FEM-Method. The sensor-system is in the position to detect accelerations in the range of ±20 g. Furthermore the sensor-element contains a printed RF-inductance, which is used for contactless data transfer. On the one hand the simulation of the L-C-oscillating circuit using the RF Module of ...

Reliability Enhancement of Bio MEMS based Cantilever Array Sensors for Antigen Detection System using Heterogeneous Modular Redundancy

L. S. Sundharam[1]
[1]Kumaraguru college of Technology, Coimbatore, Tamil nadu, India

The objective of the work is to propose a reliability enhancement model for antigen detection system (ADS) using bio MEMS based cantilever array sensors using heterogeneous modular redundancy technique. The reliability of the ADS is expressed in terms of the constituent sub systems which are heterogeneous not only in their respective structures and behaviors but also in their forms. The possible ...