Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Empirical Model Dedicated to the Sensitivity Study of Acoustic Hydrogen Gas Sensors Using COMSOL Multiphysics®

A. Ndieguene[1], I. Kerroum[1], F. Domingue[1], A. Reinhardt[2]
[1]Laboratoire des Microsystèmes et de Télécommunications/Université du Québec à Trois-Rivières, Trois-Rivières, QC, Canada
[2]Laboratoire d’Électronique et des Technologies de l’Information, CEA, LETI Grenoble, France

Due to the increasing demand for hydrogen gas sensors for applications such as automation, transportation, or environmental monitoring, the need for sensitive and reliable sensors with a short response time is increasing. This paper presents an empirical model that studies the sensitivity of acoustic hydrogen gas sensors. A parametric study based on the variation of physical properties of ...

Thermomechanical Effects of the Packaging Molding Process on the Chip in Integrated Circuits - new

N. Semmar[1], M. Fournier[1], P. S. Alleaume [2], A. Seigneurin [3], , ,
[1]GREMI-UMR7344, CNRS/University of Orléans, Orléans, France
[2]Collegium Sciences et Techniques, Orléans, France
[3]ST Microelectronics Tours SAS, Tours, France

Usually, in integrated circuits, the chip is brazed on leadframe and then, a polymer resin is molded around to create the packaging. On the first hand, the molding process at high temperatures will induce thermomechanical stress on the chip. As the leadframe, the chip and the braze have all different thermoelastic properties, these stress can be critical for the chip connections. To ...

Near-Wall Dynamics of Microbubbles in an Acoustical Trap - new

L. Wright[1], G. Memoli[1], P. Jones[2], E. Stride[3]
[1]National Physical Laboratory, Teddington, UK
[2]University College London, London, UK
[3]University of Oxford, Oxford, UK

Understanding the interactions between microbubbles and surfaces is key to the successful deployment of microbubbles in a range of applications. Two important examples are their use as a drug delivery mechanism, and their potential use of acoustically-driven bubbles as microscale sensors. Drug delivery with bubbles involves sonication at high frequency close to a boundary, and sensing with ...

Optimization of Device Geometry of a Fully-Implantable Hearing Aid Microphone

A. Dwivedi [1], G. Khanna [1],
[1] National Institute of Technology Hamirpur, Himachal Pradesh, India

The hearing impairment is affecting more than 360 million people all over the world.In India alone, 63 million people suffer from the significant auditory loss. Conventional hearing aids suffer from reliability, practicality and social stigma concerns. The totally implantable devices provide freedom from the social and practical difficulties of using conventional hearing aids. The paper presents ...

RF NEMS Magnetoelectric Sensor Simulation and Demonstration

H. Lin [1], N. Sun [1], N. X. Sun [1],
[1] W.M. Keck Laboratory for Integrated Ferroics, ECE Department, Northeastern University, Boston, MA, USA

RF NEMS Magnetoelectric (ME) Sensor with a ferromagnetic (FeGaB)/ piezoelectric (AlN) thin film heterostructure is simulated, fabricated and measured in this work. To analyze the response of the ME structures, the coupling between the magnetic, elastic and electric field in the two different magnetostrictive and piezoelectric effects should be taken into consideration. Simulations with FEM ...

The Fabrication of a New Actuator Based on the Flexoelectric Effect

S. Baskaran[1], S. Thiruvannamalai[1], N. Ramachandran[1], F.M. Sebastian[1], and J.Y. Fu[1]
[1]State University of New York at Buffalo, Buffalo, New York, USA

This paper presents a novel methodology towards the design, analysis, and the fabrication process involved in developing a cost effective method to create a piezoelectric actuator by means of the flexoelectric effect. The basic physical equations of the flexoelectric effect and the qualitative analysis of the flexoelectric actuator are done using COMSOL Multiphysics. This effect is used to align ...

Experimentally Matched Finite Element Modeling of Thermally Actuated SOI MEMS Micro-Grippers Using COMSOL Multiphysics

M. Guvench[1], and J. Crosby[1]
[1]University of Southern Maine, Gorham, Maine, USA

In “Micro-Electro-Mechanical-Systems” shortly known as MEMS, one of the most important and effective principle of creating transduction of electrical power to displacement force is thermal expansion. A slim beam of MEMS material, typically Silicon, is heated by the application of electrical current via Joule heating; it expands and creates motion. In the design of many MEMS devices ...

Analog to Digital Microfluidic Converter

R. Dufour [1], C. Wu[1], F. Bendriaa[1], V. Thomy[1], and V. Senez[1]
[1]BioMEMS Group, IEMN, University of Lille Nord de France, Villeneuve d’Ascq, France

This paper presents an Analog to Digital Microfluidic Converter (ADMC) using passive valves and enabling the conversion of a continuous liquid flow into droplets for Electro-Wetting On Dielectric (EWOD) actuation. Valves calibration, geometry characteristics and losses reduction have been optimized using microfluidic application mode of COMSOL Multiphysics®.

Heat-Sink Solution through Artificial Nanodielectrics for LED Lighting Application

N. Badi[1], R. Mekala[2]
[1]Department of Physics, Center for Advanced Materials, University of Houston, Houston, TX, USA
[2]Department of Electrical & Computer Engineering, University of Houston, Houston, TX, USA

Thermally conducting but electrically insulating materials are needed for heat-sink LED lighting applications. We report on a cost effective and innovative method based on creating core-shell nanoparticles in polymer with aluminum (Al) nanoparticles as the high thermal conductivity core and ultrathin aluminum oxide (Al?O?) as a capping shell. The solid oxide shell around the Al core prevents ...

Modeled Electroformed MEMS Variable Capacitors for Cobalt Iron Alloy Magnetostriction Measurements

E. Langlois [1], P. Finnegan [1], J. Pillars [1], T. Monson [1], C. J. Pearce [1], C. St. Johns [1], M. Ballance [1]
[1] Sandia National Laboratories, Albuquerque, NM, USA

Electroplated CoFe alloys demonstrating Joule magnetostriction (i.e., a large change in material shape induced by an applied magnetic field) have been recently developed for the creation of microfabricated magnetoelastic resonators for tagging applications. This development requires a measurement technique for evaluating film magnetostriction performance to provide feedback for optimization of ...