Robust and Reliability-based Design Optimization of Electromagnetic Actuators Using Heterogeneous Modeling with COMSOL Multiphysics and Dynamic Network Models
H. Neubert, A. Kamusella, and T-Q. Pham
Technische Universität Dresden, Germany
OptiY e. K. Aschaffenburg, Germany
For an exemplary electromagnetic actuator used to drive a Braille printer, a design optimization was performed. The optimization involves stochastic variables and comprises nominal optimization, robustness analysis and robust design optimization. A heterogeneous model simulates the static and the dynamic behavior of the actuator and its non-linear load. It consists of a network model in ...
N. Bhalla, S. Li, and D. Chung
Chung Yuan Christian University, Chungli,Taiwan
National Tsing Hua University, Hsinchu, Taiwan
Investigation in this paper aims at performing Mechanical Stress Strain analysis, Thermal, Piezoresistive and Piezoeletric analysis of Silicon Structures using COMSOL. The simulation results have been cross checked by mathematical calculation.
V. Vijayalakshmi, K. C. Devi
PSG College of Technology, Coimbatore, Tamil Nadu, India
In this work, a bimetallic strip based thermal sensor was designed using MEMS module of COMSOL Multiphysics® software to monitor the temperature rise in insulating oil which was used as coolant in transformers. The bimetallic strip was designed with different shapes such as cylindrical, rectangle, square & conical and different compositions such as Al/Steel Alloy and Fe/Cu which can withstand ...
Pryor Knowledge Systems, Inc. (COMSOL Certified Consultant), Bloomfield Hills, Michigan, USA
Materials and their related properties are intrinsically fundamental to the creation, development and solution of viable exploratory models when using numerical analysis software. In many cases, simply determining the location, availability and relative accuracy of the necessary material parameters for the physical behavior of even commonly employed design materials can be very difficult and ...
F. Bircher and P. Marmet
Institute of Print Technology, Bern University of Applied Sciences, Burgdorf, Switzerland
Electromagnetic micro valves are currently developed empirically or the different physics are treated separately. To accelerate the development-process and for a better understanding of the overall system, a multiphysics simulation is built up. This simulation considers the electromagnetics, the electronics (including the control of the process), the mechanics and the fluidics with respect to ...
S. Suganthi, M. Anandraj, and L. Sujatha
Department of Electronics & Communication Engineering, Rajalakshmi Engineering College, Chennai, India
Department of Physics, Rajalakshmi Engineering College, Chennai, India
Porous Silicon (PS) can easily be formed by electrochemical etching of silicon in HF based electrolytes at room temperature. Since, PS is compatible with silicon IC technology; it finds lot of applications in the fabrication of MEMS devices. In the current study, we discuss the design of a condenser microphone using a Silicon/ Porous Silicon composite membrane as a movable plate. The performance ...
S. Druart, D. Flandre, and L.A. Francis
Université catholique de Louvain - ICTEAM, Louvain-la-Neuve, Belgium
In this paper, a methodology to simulate the electric behavior of spiral inductances is presented and discussed. All the methodology is built with the COMSOL software used with the Matlab scripting interface and then allows performing fully parameterized simulations. The program architecture is explained and is used to simulate two applications. The first calculates the voltage induced by an ...
S. Takahashi, S. Ogata
Tokyo Metropolitan University Hachioji City, Tokyo, Japan
We studied the influence of a number of gas-liquid interface on the drag reduction effect by numeric simulation. Level set method was used for an analysis of gas-liquid interface. The analytic model is rectangular channel of height h = 5 micrometer and width w = 20 micrometer with two hydrophobic microstructures in bottom of channel. In this channel, we found that the liquid penetrates in the ...
N. Semmar, M. Fournier, P. S. Alleaume , A. Seigneurin , , ,
GREMI-UMR7344, CNRS/University of Orléans, Orléans, France
Collegium Sciences et Techniques, Orléans, France
ST Microelectronics Tours SAS, Tours, France
Usually, in integrated circuits, the chip is brazed on leadframe and then, a polymer resin is molded around to create the packaging. On the first hand, the molding process at high temperatures will induce thermomechanical stress on the chip. As the leadframe, the chip and the braze have all different thermoelastic properties, these stress can be critical for the chip connections. To ...
3D Stationary and Temporal Electro-Thermal Simulations of Metal Oxide Gas Sensor Based on a High Temperature and Low Power Consumption Micro-Heater Structure
N. Dufour, C. Wartelle, P. Menini
LAAS-CNRS, Toulouse, France
Renault, Guyancourt, France
The aim of this work was to simulate the electro-thermal behavior of a micro-hotplate used as a gas sensor, in order to compare the obtained results with a real structure. The structure has been designed in 3D and a stationary and a temporal study has been realized.