Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Tunable MEMS Capacitor for RF Applications

H. S. Shriram[1], T. Nimje[1], D. Vakharia[1]
[1]BITS Pilani, Rajasthan, India

Radio Frequency MEMS devices have emerged to overcome the problem of high losses associated with semiconductors at high frequencies. A tunable MEMS capacitor is a micrometre-scale electronic device whose capacitance is controlled through different actuation mechanisms which govern the moving parts. It can have electrostatic or electrothermal actuators depending on the functional complexity and ...

Simulation of Deformed Solid Particles in Constrained Microfluidic Channel

M. Cartas-Ayala[1], R. Karnik[1]
[1]Massachusetts Institute of Technology, Cambridge, MA, USA

Characterization of particles has numerous applications in science and diagnostics. Recently, particle passage through constrained microchannels has been proposed to characterize particles based on their passage velocity. Nevertheless, there is no clear understanding of how the physics in this system interact. Here we quantify the effects of the flow around the particle by simulating the passage ...

Analysis & Design Optimization of Laterally Driven PolySilicon Electro-thermal Microgripper for Micro-objects Manipulation

T. Pahwa[1], S. Gupta[1], V. Bansal[1], R. Narwal[1], B. Prasad[1], D. Kumar[1]
[1]Electronic Science Department, Kurukshetra University, Kurukshetra, India

Micro-grippers find applications in micro-robotics, microsurgery, micro-fluidics, micro-relays, assembling and miniature medical instrumentation. Actuation principle involved may be electrothermal, electrostatic, piezoelectric, shape memory and electromagnetic. It has been found that thermal actuation provides greater displacement at low voltages when compared to other mechanisms. A 3-D ...

VLSI Layout Based Design Optimization of a Piezoresistive MEMS Pressure Sensors using COMSOL Multiphysics

R. Komaragiri[1], Sarath. S.[1], N. Kattabomman[1]
[1]NIT Calicut, Kozhikode, Kerala

This paper focuses on the diaphragm design and optimization of a piezoresistive Micro Electro Mechanical System (MEMS) pressure sensor by considering Very Large Scale Integration (VLSI) layout schemes. The aim of these studies is to find an optimal diaphragm shape by Finite Element Method (FEM) using COMSOL®, which is most suitable for VLSI layout. Optimal diaphragm shape is a diaphragm shape ...

Passive Microsensor Based on LC Resonators for Substance Identification

D.A. Sanz Becerra[1], E.A. Unigarro Calpa[1], J. Osma[1], F. Segura[1]
[1]Universidad de los Andes, Bogotá, Colombia

A scheme for inductive wireless powering and readout of passive LC sensor is presented. The sensor’s inductor is designed as a planar square coil and is used as the power receiving component. The capacitor is connected directly to the inductor and it was designed as an interdigital capacitor. With a transmitting coil (coupling antenna), an electromagnetic field is generated which couples with ...

Wireless RF Digital System for Mouth-Embedded Multi-Sensor Communication

I.M. Abdel-Motaleb[1], J. Lavrencik [1]
[1]Department of Electrical Engineering, Northern Illinois University, DeKalb, IL, USA

There is urgent need to monitor dental and oral diseases, such as tooth decay, gum diseases, and teeth grinding. Such monitoring can be achieved by embedding sensors in the mouth. This technique faces some difficulties. The first is how the power needed for the operation of the sensors and the associated electronic chips can be generated. This power can be generated using the pressure exerted by ...

Quartz Transducer Modeling for Development of BAW Resonators

L.B.M. Silva[1], E.J.P. Santos[1]
[1]Laboratory for Devices and Nanostructures, Electronics and Systems Department, Universidade Federal de Pernambuco, Recife, PE, Brasil

Transducer optimization is a key aspect for successful development and deployment of advanced sensors, especially when designing 3D structures for harsh environments. For piezoelectric transducers, plate thickness determines the operating frequency of the resonator, which is frequently tuned in the shear thickness vibration mode. Quartz has been the material of choice for the fabrication of ...

Mixing and Residence Time Distribution Studies in Microchannels with Floor Herringbone Structures

A. Cantu-Perez, S. Ping Kee, and A. Gavriilidis
University College London, Department of Chemical Engineering, Torrington Place, London, UK

The mixing characteristics and residence time distributions (RTDs) of a staggered herringbone microchannel have been investigated numerically by COMSOL Multiphysics and by particle tracking algorithms that incorporate diffusion via a random walk. All simulations were validated with experimental data. It was found that for low Peclet numbers the use of herringbone structures have little impact on ...

Nondestructive Testing of Composites Using Model Based Design

E. Nesvijski[1]
[1]ACOUSTICS@MBD CONSULTANTS, LLC, Westborough, MA, USA

There is a practical interest among composite materials manufacturers to high-speed accurate non-destructive evaluation (NDE) technology for voids inspection when these voids are natural components of such complex structures like resin insulated layer of double-sided copper-clad laminates. Model based design (MBD) of NDE system is one of principal solutions for voids inspection in such ...

Chip Drop After Silver Sintering Process

M.H. Poech[1], M. Weiß[1], and K. Gruber[1]

[1]Fraunhofer Institute for Silicon Technology, Itzehoe, Germany

Since a couple of years, sintering becomes more and more important for power electronics. To press a semiconductor under high temperature in silver paste on a substrate promises benefits for durability. Tests with semiconductors of different thickness expose some problems. After the cool down, some of them fall slightly from the substrate. Stress in the boundary layer, caused by different ...

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