Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Modeling Residual Stresses in Arc Welding

F. Roger[1], and A. Traidia[2]
[1]ENSTA Paristech, Paris, France
[2]AREVA NP, Saint Marcel, France

The prediction of mechanical response of assemblies during arc welding necessitates the knowledge of thermal history of the components and the constitutive behavior of the materials. COMSOL can simulate thermal and structural interaction but it needs to evaluate the time evolution of internal variables like viscoplastic strain and hardening parameters. In the present paper we extend the ...

Modeling Convection during Melting of a Phase Change Material

D. Groulx, and R. Murray
Mechanical Engineering
Dalhousie University
Halifax, NS
Canada

COMSOL Multiphysics can be used to model a latent heat energy storage system. A 2D numerical study was performed to simulate melting of a PCM including both conduction and convective heat transfer. The heat transfer in fluids and laminar flow physics interfaces were used. To model natural convection, proper volume force was applied to the PCM. The viscosity was input as a piecewise, continuous ...

Solid Target Cooling for High Power Neutrino Super Beam

B. Lepers, and C. Bobeth
IPHC, CNRS, Strasbourg, France

The feasibility of water cooling is investigated for a solid target which is integrated as the inner conductor in a magnetic horn for secondary particle focusing (pi; K) as used in conventional neutrino beam accelerator experiment. A simple axi-symmetric thermal model calculated in COMSOL is used to obtain the temperature distribution inside the target for different values of h; power beam and ...

Thermal FEM Simulation Of A Multilevel Lab On Chip Device For Genetic Analysis

E. Giuri, A. Ricci, and S.L. Marasso
Politecnico di Torino, Materials Science and Chemical Engineering Department, Turin, Italy

In this work, time dependent thermal analyses, performed on the 3D FE model of a multilevel Lab on Chip (LOC) platform are executed in order to gain insight into the temperature distribution within the device. By means of the COMSOL Multiphysics CAD import module, an extremely close 3D reproduction of the actual device, allowing to probe temperatures in those regions where an experimental ...

Implementation of a Viscoelastic Material Model to Simulate Relaxation in Glass Transition - new

Z. Zheng[1], R. Zhang[1]
[1]Corning Incorporated, Corning, NY, USA

Introduction: Glass relaxation occurs in a range of temperature during transition from equilibrium to super-cooled liquid. Viscoelastic material model can be applied to simulate glass behavior during the glass transition regime and to predict the glass deformation and stress evolution. Viscoelasticity is the property of materials that exhibit both viscous and elastic characteristics when ...

High Temperature Process Simulation

O. Geoffroy, and H. Rouch
INOPRO, Villard de Lans, France

The crystal growth industry uses high temperature processes. To improve production efficiency, a good knowledge of thermal effects is necessary. We show in this article a methodology to get reliable data by mixing simplified models, sensitivity studies and parameters adjustments. The precision is improved by comparison with experimental measurements.

A Practical Method to Model Complex Three-Dimensional Geometries with Non-Uniform Material Properties Using Image-based Design and COMSOL Multiphysics®

J. Cepeda[1], S. Birla[2], J. Subbiah[2], H. Thippareddi[1]
[1]Department of Food Science & Technology, University of Nebraska, Lincoln, NE, USA
[2]Department of Biological Systems Engineering, University of Nebraska, Lincoln, NE, USA

Geometries with heterogeneous material properties are typically defined as a set of multiple parts, each part representing a different material. However, assembling or defining the individual parts of complex geometries can be difficult. A practical method based on image-based mesh generation, a custom algorithm for labeling materials, and interpolation functions of COMSOL Multiphysics® can be ...

Natural Convection Driven Melting of Phase Change Material: Comparison of Two Methods

D. Groulx[1], F. Samara[1], P.H. Biwole[2]
[1]Department of Mechanical Engineering, Dalhousie University, Halifax, NS, Canada
[2]Department of Mathematics and Interactions, University of Nice Sophia-Antipolis, Nice, France

Design of latent heat energy storage systems (LHESS) requires knowledge of heat transfer processes within them, as well as the phase change behavior of the phase change material (PCM) use. COMSOL Multiphysics can be used to model (LHESS). Natural convection plays a crucial role during the charging phase of the LHESS, and methods to incorporate this heat transfer mode within COMSOL simulation ...

Analysis of Burning Candle

J.S. Crompton, L.T. Gritter, S.Y. Yushanov, and K.C. Koppenhoefer
AltaSim Technologies LLC, Columbus, OH, USA

Analysis of burning candles is extremely complex; combustion produces a highly non-linear temperature profile through the flame in which local temperatures may exceed 1400 °C. Heat transfer includes radiation, conduction and convection components and the low melting point of the candle wax leads to a phase change that allows mass transport via capillary flow prior to combustion in the flame. ...

Simulation of the Temperature Profile During Welding with COMSOL Multiphysics® Software Using Rosenthal's Approach - new

A. Lecoanet[1], D. G. Ivey[1], H. Henein[1]
[1]Department of Chemical & Materials Engineering, University of Alberta, Edmonton, AB, Canada

A 3D finite element analysis is carried out, using COMSOL® software, to reproduce the thermal profile obtained with Rosenthal’s equation. The implemented heat transfer equation has been modified as a means to approximate Rosenthal’s solution. An analysis of the differences between the simulation and Rosenthal’s solution, when the geometry of the domain and the source are changed, has been ...

1 - 10 of 552 First | < Previous | Next > | Last