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Viscoplastic Creep in Solder Joints

Application ID: 4488

This example studies viscoplastic creep in solder joints under thermal loading using the Anand viscoplasticity model, which is suitable for large, isotropic, viscoplastic deformations in combination with small elastic deformations.

The geometry includes two electronic components (chips) mounted on a circuit board by means of several solder ball joints. Significant plastic flow appears after about 40 s of thermal loading.