Thermal Initial Stresses in a Layered Plate
Application ID: 273
The thermal stress in a layered plate is studied in this example. A plate consisting of two layers, a coating and a substrate layer is stress and strain free at 800 degrees C. The temperature of the plate is reduced to 150 degrees C and thermal stresses are induced. A third layer, the carrier layer, is added and the thermal stresses in the coating and a substrate layer are added as an initial stress and the temperature is finally reduced to 20 degrees C.
This model is included as an example in the following products:MEMS Module Structural Mechanics Module
however additional products may be needed to reproduce it. This example may be created and run using components from the following product combinations:
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