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Residual Stress in a Thin Film Resonator - 3D

Application ID: 477

Surface micromachined thin films are often subject to residual stress. This COMSOL Multiphysics example describes a thin film resonator with straight or folded cantilever beam springs. The resonance frequencies of the resonator are affected by thermal stress. Using folded springs relieves this effect.

The example is made up of four models: two thin film resonators with folded cantilever beam springs in 2D and 3D, and two thin film resonators with straight cantilever beam springs in 2D and 3D. The folded flexures relieve axial stress.

This application was built using the following:

MEMS Module

The combination of COMSOL® products required to model your application depends on the physics interfaces that define it. Particular physics interfaces may be common to several products (see the Specification Chart for more details). To determine the right combination of products for your project, you should evaluate all of your needs in light of each product's capabilities, consultation with the COMSOL Sales and Support teams, and the use of an evaluation license.