Application ID: 8577
In every system where there is conduction of electric current, and where the conductivity of the material is finite, there will be electric heating. Electric heating, also referred to as Joule heating, is in many cases an undesired by-product of current conduction. This model simulates a system consisting of a small part of a circuit board containing a power transistor and the copper pathways connected to the transistor. The purpose of the simulation is to estimate the operating temperature of the transistor, which can be substantially higher than room temperature due to undesired electric heating. The power transistor, in this case an off-the-shelf product, can be mounted on a heat sink. However, in this simulation, we will investigate if heat sink mounting is necessary or if the operating temperature can be low enough to leave the system undamaged in the absence of a heat sink.
This application was built using the following:Heat Transfer Module
The combination of COMSOL® products required to model your application depends on the physics interfaces that define it. Particular physics interfaces may be common to several products (see the Specification Chart for more details). To determine the right combination of products for your project, you should evaluate all of your needs in light of each product\'s capabilities, consultation with the COMSOL Sales and Support teams, and the use of an evaluation license.