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Microresistor Beam

Application ID: 366

This example illustrates the ability to couple thermal, electrical, and structural analysis in one model. This particular application moves a beam by passing a current through it; the current generates heat, and the temperature increase leads to displacement through thermal expansion. The model estimates how much current and increase in temperature are necessary to displace the beam. Although the model involves a rather simple 3D geometry and straightforward physics, it provides a good example of multiphysics modeling.

This application was built using the following:

MEMS Module