CARCO, Basiano, Milano, Italy
Simulations of more than one type of seal have been done where the deformation and the stress of the seal itself or the pressure on the housing are of interest. According to the deformation of the seal we can modify the housing of the seal or its geometry depending on the design constraints to meet. Stresses on the seal are indicators of which changes have to be implemented on the geometry so to ...
Evaluation of Low-Cycle-Fatigue Life of Solder Joints in Surface Mounting Power Devices by Finite Element Modeling
N. Delmonte, F. Giuliani, M. Bernardoni, P. Cova
Dipartimento di Ingegneria dell'Informazione, Università degli Studi di Parma, Parma, Italy
CDTR - Centre for Device Thermography and Reliability, H. H. Wills Dept. of Physics, University of Bristol, Bristol, United Kingdom
The reliability of solder joints [1,2] is one of the key factors in the determination of the reliability of the high power density electronic converters, being the solder joints both the mechanical, the electrical, and often the thermal connections between the electronic component and the board in which the component is placed. The main mechanism by which solder joints are damaged is thermal ...
Kinetic Investigation of a Mechanism for Generating Microstructures on Polycrystalline Substrates Using an Electroplating Process
T. Soares, H. Mozaffari, H. Reinecke
Universität Freiburg, Freiburg im Breisgau, BW, Germany
Hochschule Furtwangen, Tuttlingen, BW, Germany
The purpose of this study is to understand the growth mechanism of copper (Cu) films on a Cu-Zn system substrate with a pre-defined pattern. The pattern was defined by conducting a selective etching process on a two-phase polycrystalline substrate. As a result of this process, there were etched regions correspondent to beta-phase crystals and quasi non-etched regions that belong to alpha-phase ...
ABB, Corporate Research, Västerås, Sweden
Modern power transmission systems are in general designed to operate at high voltages in order to reduce resistive losses generated by high currents. This, however, tends to increase the risk for dielectric breakdown or flashovers if the equipment is not properly designed to withstand the stress. The present work illustrates how multiphysics simulations can be used to analyze and predict the ...
A. Fadel, G. Fontana
Isoil Impianti, Albano S. Alessandro, Italy
Industrial applications of fluid mechanics can require to satisfy necessities as diverse as legal norms, optimization requirements and manufacturing constraints. Therefore a Computational Fluid Mechanics software often becomes a must in the development of new devices or the improvement of older ones. Besides the legalistic aspect (such as the European Pressure Equipment Directive), several steps ...
M. Mruczkiewicz, M. Krawczyk, V.K. Sakharov, Yu. V. Khivintsev, Yu. A. Filimonov, S. A. Nikitov
Nanomaterials Physics Division, Faculty of Physics, Adam Mickiewicz University, Pozna?, Poland
Kotel’nikov Institute of Radio Engineering and Electronics, Russian Academy of Sciences (Saratov Branch), Saratov, Russia; Laboratory “Metamaterials”, Chernyshevsky Saratov State University, Saratov, Russia
Kotel’nikov Institute of Radio Engineering and Electronics, Russian Academy of Sciences, Moscow, Russia; Laboratory “Metamaterials”, Chernyshevsky Saratov State University, Saratov, Russia
FMR spectra of the periodic microstructures (one-dimensional magnonic crystals, 1D MCs) were obtained using COMSOL with use partial differential equation interface. Results of these calculations were successfully compared with an experimental data for Damon-Eshbach (DE) and Backward-Volume (BV) geometries. The presented tool allows to analyze periodic structures with various geometries and ...
H.P. Schmidt , U. Vogl
UAS HAW Amberg-Weiden, Amberg, Germany
For the design of an inductive power and data transfer electromagnetic calculation are carried out. A transfer system is considered for loads that are distributed across some distances. For example, such loads are adjustable speed drives that are found in factory automation and intra-logistic. Physical properties of the inductive transfer are modeled via COMSOL. Lumped parameters are deduced from ...
I.M. Abdel-Motaleb, J. Lavrencik 
Department of Electrical Engineering, Northern Illinois University, DeKalb, IL, USA
There is urgent need to monitor dental and oral diseases, such as tooth decay, gum diseases, and teeth grinding. Such monitoring can be achieved by embedding sensors in the mouth. This technique faces some difficulties. The first is how the power needed for the operation of the sensors and the associated electronic chips can be generated. This power can be generated using the pressure exerted by ...
A. Dobrinsky, M. Shatalov, M. Shur, R. Gaska
Sensor Electronic Technology, Columbia, SC, USA
Deep Ultraviolet Light Emitting Diodes (DUV LEDs) are presently operating at a relatively low efficiency, thus large amount of LED driving power is dissipating in heat. Thermal heating degrades LED performance and decreases LED’s lifetime. The degradation of DUV LED devices with temperature increase makes thermal management a key issue for DUV LEDs. We present a thermal analysis of DUV LED ...
Finite Element Convergence and Speed-Up Studies Using COMSOL Multiphysics and LiveLink™ for MATLAB® with Large Assembly Models
H. Pourzand, A.H. Aziz, A. Singh
Pennsylvania State University, State College, PA, USA
COMSOL Multiphysics along with its LiveLink™ for MATLAB® is used to investigate the needed number of elements and the required order of Lagrangean p element for a number of different simulation models. For this task, convergence study, speed up testing and interactive meshing is performed on a large assembly model which is also imported using the LiveLink™ for SolidWorks®. As a test bench, ...