Technical Papers and Presentations

Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Drift of Space Charge Produced by Glow Corona During Thunderstorms

M. Becerra
ABB Corporate Research, Power Technologies, Electrical Apparatus and Diagnostics group, Västerås, Sweden

Glow corona discharges are generated from tall objects during thunderstorms previous to a lightning strike. These discharges generate space charge which can hinder the development of subsequent discharges. In order to quantify the shielding effect of positive glow corona, a transient, two dimensional model of the drift of the space charge generated on the tip of tall objects under the ...

Investigations on Hydrodynamic in Stirred Vessels for Educational Purposes

A. Egedy, T. Varga, and T. Chován
University of Pannonia
Department of Process Engineering
Veszprém, Hungary

With detailed hydrodynamic modelling of a system the critical parameters and operation limits can be determined. In the field of fluid dynamic and reactor engineering one of the most important aspects is the practical knowledge of future engineers and technicians. In our research several different reactor constructions and impeller configurations were modelled to achieve a better ...

Efficiency of Evacuated Tubular Solar Thermal Collector

J. Ma and X. Wei
Southeastern Louisiana University
Hammond, LA

Using COMSOL® 3.5a, models were created to simulate the heat transfer between the working fluid and the selective coating as well as the natural convection of the working fluid itself. In these models, a constant heat input on half of the selective coating facing the sun was considered as energy input from the sun, and the open end of the tube, where the working fluid can flow in and out of the ...

Finite Element Analysis of Integrated Circuit Interconnect Lines on Lossy Silicon Substrate

S. Musa[1], M. Sadiku[1], and A. Emam[2]

[1]Roy G. Perry College of Engineering, Prairie View A&M University, Prairie View, TX
[2]Information Systems Department, King Saud University, Riyadh, Saudi Arabia

The silicon substrate has a significant effect on the inductance parameter of a lossy interconnect line on an integrated circuit. It is essential to take this into account in determining the transmission line electrical parameters. In this paper, a new quasi-TEM capacitance and inductance analysis of multiconductor multilayer interconnects is successfully demonstrated using the finite element ...

Optimization of a High-Temperature High-Pressure Direct Wafer Bonding Process for III-V Semiconductors

R. Martin, J. Kozak, K. Anglin, and W. Goodhue
University of Massachusetts Lowell
Lowell, MA

Many optoelectronic devices utilize a heterojunction of a pair semiconducting materials including high-efficiency MEMS devices, solar cells, LEDs, and VCSELs. One fabrication technique which achieves such a device is direct wafer fusion. To optimize the process, COMSOL Multiphysics 4.0 was used to test various geometric configurations of the fixture. 2D and 3D models were created in order ...

Computational Acoustic Attenuation Performance of Helicoidal Resonators

W. Lapka
Poznan University of Technology
Poznan, Poland

This paper concerns the problem of obtaining proper acoustic attenuation performance through computations. COMSOL was used to solve acoustics systems with helicoidal resonators in the frequency domain. Based on the studies of insertion and transmission loss of helicoidal resonators, a high consistency between the results obtained by numerical calculations with experimental measurements was ...

Simulation of a Seal

V. Viola[1]
[1]CARCO, Basiano, Milano, Italy

Simulations of more than one type of seal have been done where the deformation and the stress of the seal itself or the pressure on the housing are of interest. According to the deformation of the seal we can modify the housing of the seal or its geometry depending on the design constraints to meet. Stresses on the seal are indicators of which changes have to be implemented on the geometry so to ...

Seasonal Thermal Performance of Geothermal Piles

D. Testi[1], P. Conti[1]
[1]University of Pisa, Department of Energy and Systems Engineering, Pisa, Italy

The use of foundation piles as ground heat exchangers coupled to a geothermal heat pump is considered of interest for possible savings in installation costs, compared to conventional borehole heat exchangers. We refer to them as “geothermal piles” or “energy piles”. The main purpose of the foundation structure is to transmit the load of the building to the lower layers of the soil, best ...

Multiphysics Modeling of a Metal Foam

B. Chinè [1][3], M. Monno[2]
[1]Laboratorio MUSP, Macchine Utensili e Sistemi di Produzione, Piacenza, Italy
[2]Politecnico di Milano, Dipartimento di Meccanica, Milano, Italy
[3]Instituto Tecnologico de Costa Rica, Cartago, Costa Rica

Introduction: In metal foams production, nucleated gas bubbles expand in a heated metal in a mold, then the foam cool and solidify. Thereby energy, mass and momentum transfer mechanisms are present simultaneously in the system and must be taken into account. Metal foam (Figure 1) can be obtained by foaming a precursor, i.e. a mixing of aluminum (Al) powders with the blowing agent TiH2, placing it ...

Contactless Power and Data Transfer for Multiple Nonlinear Loads

H.P. Schmidt [1], U. Vogl[1]
[1]UAS HAW Amberg-Weiden, Amberg, Germany

For the design of an inductive power and data transfer electromagnetic calculation are carried out. A transfer system is considered for loads that are distributed across some distances. For example, such loads are adjustable speed drives that are found in factory automation and intra-logistic. Physical properties of the inductive transfer are modeled via COMSOL. Lumped parameters are deduced from ...

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