Technical Papers and Presentations

Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

High Coupling Factor Piezoelectric Materials for Bending Actuators: Analytical and Finite Elements Modeling Results

I.A. Ivan[1], M. Rakotondrabe[1], and N. Chaillet[1]
[1]FEMTO-ST Institute, University of Franche-Comte, Besançon, France

New giant piezoelectric factor materials such as PMN-PT and PZN-PT were researched during the last decade and are actually becoming commercially available. As they seem very attractive for actuator designs, we studied their potential in replacing PZT ceramics. In a first comparative approach, we tested a series of classic rectangular composite bimorph structures of different combinations of ...

Viscous damping of a periodic perforated MEMS microstructure when the Reynolds’ equation cannot be applied: Numerical simulations

D. Homentcovschi[1], and R.N. Miles[1]
[1]Department of Mechanical Engineering, SUNY Binghamton, NY

This paper develops a computational model for determining the total damping coefficient for a unit cell of a MEMS microscale device containing a repetitive pattern of holes. The basic cell of the microstructure is approximated by an axi-symmetric domain and the velocity and pressure fields are determined from solutions of the Navier-Stokes equations using the finite element software package ...

Modeling an electric cell actuator and loudspeaker using COMSOL Multiphysics

W. J. Wu
NTU Nano-Bio MEMS Group
National Taiwan University,

This presentation presented the following: * The building of an FEA model of an electric cell actuator using COMSOL Multiphysics * Validation of this model through the AVID and ESPI measurement systems * The building of an FEA model of an electric loudspeaker using COMSOL Multiphysics * Validation of this model throughan acoustic measurement systems This paper is in Chinese.

Computational Analysis of Evaporation in Tailored Microchannel Evaporators

S. Arslan[1], J. Brown[1]
[1]Lawrence Technological University, Southfield, MI, USA

The rapid increase in power densities of integrated circuits has induced a significant interest in new reliable and high heat flux cooling technologies. The implication of such growth is the increased need for more efficient and more compact cooling mechanisms. Promising research has been conducted in the area of MEMS cooling devices, taking advantage of the increased heat transfer ...

Simulation of Daisy Chain Flip-Chip Interconnections

G.S. Durante[1] and M. Fretz[1]

[1]CSEM Zentralschweiz, Alpnach Dorf, Switzerland

Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive adhesive (ACA) bonding, and AuSn20 eutectic solder. The single bumps were then measured with a high precision ...

Novel Sensor Technology for Point of Care Diagnostics

V. Djakov
Sensor Development Director
Microvisk Technologies Ltd

Dr Vladislav Djakov is the co-founder of Microvisk Technologies Ltd and the inventor of its MEMS-based Technology. Born in Belgrade, Serbia he came to UK in 1995 to pursue M.Sc. in Artificial Intelligence followed by Ph.D. in Micro-robotics. With over 14 years of extensive ‘hands-on’ expertise on a number of micro-fabrication techniques, using standard and novel materials, as well as ...

Development of laser-driven micromachines using total internal reflection

S. Maruo
Yokohama National University, Yokohama, Japan

Laser-driven micromachines using total internal reflection were developed by using two-photon microfabrication. The optical torque exerted on the micromachine was evaluated by COMSOL Multiphysics software. The laser-driven micromachines will be applied to lab-on-a-chip devices.

Flexible MEMS Actuated Display System and Modeling Optimization

G. Tortissier[1], C.-Y. Lo[2], H. Fujita[1], and H. Toshiyoshi[1,3]
[1]LIMMS/CNRS-IIS(UMI-2820), Institute of Industrial Science, The University of Tokyo, Tokyo, Japan
[2]Institute of NanoEngineering and MicroSystems, National Tsing Hua University, Taiwan
[3]Research Center for Advanced Science and Technology, The University of Tokyo, Tokyo, Japan

Previous works on MEMS actuated Fabry-Perot interferometer (FPI) highlighted promising results for flexible display applications. Three primary color pixels have indeed been obtained using both photolithography and Roll-to-Roll printing process with satisfying color purity and transmittance. However both of these processes are expensive and time-consuming for preparing micropatterns. For these ...

MEMS RF Switch For CPW Circuits

G. Umesh[1], P. Bhat[2], and M.S. Bhat[2]
[1]Physics Dept., NITK Surathkal, Mangalore, Karnataka, India
[2]Dept. of E&C, NITK Surathkal, Mangalore, Karnataka, India

We have simulated a capacitive MEMS switch for application to Coplanar Waveguide (CPW) circuits using COMSOL Multiphysics. The switch configuration involves a pair of metal bridges over the CPW line designed for operation in the Ka - Band frequencies. It is shown that the operating frequency of the switch can be tuned by adjusting the gap between the two bridges. Estimation of the switch ...

Design and Simulation of Flying Microids

J. Clark, F. Li, B. Khandagale, and J.V. Clark
Purdue University, West Lafayette, IN, USA

In this paper we present the first design and simulation results of flying microids. Microids are a particular type of microrobots that have insect-like dexterity. Our initial investigation into the ability of microids to walk, run, jump, turn, carry loads, and walk upside-down was previously presented. Having the ability to fly greatly extends transportability. Although others have previously ...

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